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 Infrared Transceiver Technical Data
HSDL-1100
Features
* Fully Compliant to IrDA 1.1 - 4 Mbps * Compatible with ASK, HPSIR, and TV Remote * Backward Compatible to Slower Speeds * Excellent Nose to Nose Operation * Excellent Noise Immunity * No Programming to Switch Speeds * Available in Several Mounting Options * Designed to Compensate for Light Loss Due to Cosmetic Windows * Fully Supported by All Interface Chips
115.2 Kb/s and RXD-B for signal rates of 576 Kb/s and 4.0 Mb/s. The receiver is designed for maximum sensitivity to IrDA signals and minimum sensitivity to signals outside the IrDA optical wavelength and frequency modulation of interest. A receiver lens magnifies the effective area of the PIN diode to enhance sensitivity. The lens is integral with the molded package and contains a dye which absorbs visible light. Receiver outputs pulse low when the IR signal is present. The power supply for the PIN and preamplifier are filtered to attenuate noise conducted from external sources.
Applications for the HSDL-1100 include notebook PCs, LANs, telephones, pagers, printers, cameras, and industrial handheld devices.
VCC
Application Circuit Description
The HSDL-1100 infrared transceiver provides the interface between logic and IR signals for through-air, serial, half-duplex IR data links and is designed to satisfy the IrDA Physical Layer Specification. The HSDL-1100 contains a high speed, high efficiency, TS AlGaAs 870 nm LED, a silicon PIN photodiode, and a bipolar, silicon integrated circuit. The IC contains an LED driver and a receiver providing two output signals, RXD-A for signal rates from 2.4 to
HSDL-1100 CX2 TX R1 7 CX7
R2 10 LEDA IE
TXD
EI PIN BIAS VCC CX6 CX1 1 CX1 GND 6 CX4 3 CX4 CX3 9 CX3 R3 CX5 2 GND
ADAPTIVE THRESHOLD & SQUELCH
RXD-A 8 VREF RXD-B 5
4
VCC
2
Ordering Information
Specify Part Number followed by Option Number HSDL-1100 #0x7 017 front mount orientation, 10 piece increment 007 front mount orientation, 200 piece increment HSDL-1100 #0x8 018 top mount orientation, 10 piece increment 008 top mount orientation, 200 piece increment HSDL-1100 #S07 front mount orientation, integrated shield, 200 piece increment
Package Dimensions
Option #0x7
13.21 0.10 (0.520 0.004) 3.43 (0.135) 0.43 (0.02) MAX. 0.47 0.10 (0.019 0.004) 8.75 0.20 (0.345 0.008) 6.86 0.10 (0.270 0.004)
-B-
6.35 (0.250)
(12x) 4.42 0.15 (0.174 0.006)
(2x) 6.84 0.15 (0.269 0.006) THE -B- DATUM IS FORMED BY THE HIGHEST POINT ON THE SURFACE AND THE HIGHEST POINT ON THE CORRESPONDING SURFACE OF THE LEAD ON THE OTHER SIDE OF THE PACKAGE. (12x) 5.0 3.5 (12x) 0.63 0.12 (0.025 0.005)
3.50 0.20 (0.138 0.008) (7x) 1.27 0.10 BSC (0.050 0.004)
-C-
R 2.87 (0.113) (8x) 0.51 (0.020)
R 2.77 (0.109)
1.00 0.10 (2x) (0.039 0.004)
2.61 0.20 (0.103 0.008)
5.94 0.10 (0.234 0.004) 15.89 0.25 (0.626 0.010) (2x) 1.20 0.10 (0.047 0.004)
6.22 0.10 (0.245 0.004)
4.10 0.20 (0.161 0.008)
4.41 0.20 (0.173 0.008) 2.71 0.20 (0.106 0.008)
-A-
1.71 0.20 (0.067 0.008) COPLANARITY OF LEADS TO BE O.1 mm (0.076 mm TOOL)
(2x) 0.9 0.2 (0.03 0.01)
(2x) 1.20 0.20 (0.047 0.008)
(2x) 0.97 0.10 (0.038 0.004)
DIMENSIONS IN MILLIMETERS (INCHES).
3
Option #0x8
13.21 0.10 (0.520 0.004) 3.43 (0.135) 0.43 (0.02) MAX. 0.47 0.10 (0.019 0.004) THE -B- DATUM IS FORMED BY THE TWO HIGHEST POINTS OF THE COMBINED SURFACE FORMED BY THIS SURFACE AND THE CORRESPONDING SURFACE OF THE SAME LEAD ON THE OPPOSITE SIDE OF THE PACKAGE. 6.86 0.10 (0.270 0.004)
-B-
6.35 (0.250)
(4x) 0.67 (0.026)
1.46 (0.057) 3.86 0.15 (0.152 0.006) (7x) 1.27 0.10 BSC (0.050 0.004)
-C-
1.46 (0.057) R 2.87 R 2.77 (0.113) (0.109) (8x) 0.51 (0.020) (2x) 1.18 0.10 BSC (0.047 0.004)
8.85 0.25 (0.348 0.010) (12x) 1.15 0.15 (0.045 0.006)
6.22 0.10 (0.245 0.004)
-A-
5.94 0.10 (0.234 0.004)
(12x) 5.0 3.5 4.62 0.20 (0.182 0.008) (12x) 1.70 0.10 (0.067 0.004) DIMENSIONS IN MILLIMETERS (INCHES).
(12x) 0.63 0.12 (0.025 0.005) 16.61 0.25 (0.654 0.010) LEAD COPLANARITY 0.1 mm
Option #S07
3.43
13.21 0.10 6.35
0.47 0.10 6.86 0.10
-B-
R
2.
R 87
2.
77
11.90 0.15 (12x) 4.42 0.15 6.84 0.15
1.00 THE -B- DATUM IS FORMED BY THE HIGHEST POINT ON THE SURFACE AND THE HIGHEST POINT ON THE CORRESPONDING SURFACE OF THE LEAD ON THE OTHER SIDE OF THE PACKAGE. 3.50 0.20
-C-
5.0 3.5 (8x) 0.51 0.63 0.12
(7x) 1.27 0.10
2.61 0.20 (2x) 1.00 0.10 15.89 0.25
2.71 0.20 (2x) 1.20 0.10
4.10 0.20 6.22 0.10
-A-
4.41 0.20 5.94 0.10 4.66 0.10
1.71 0.20 COPLANARITY OF LEADS TO BE 0.1 mm (0.076 mm TOOL) DIMENSIONS IN MILLIMETERS.
0.9 0.2
(2x) 1.20 0.20
4
Tape and Reel Dimensions
Option #0x7
24.00 0.10 (0.945 0.004) 4.00 0.10 (0.157 0.004)
1.50 0.10 (0.059 0.004)
2.00 0.10 (0.079 0.004)
1.75 0.10 (0.069 0.004)
14.20 0.10 (0.559 0.004)
32.00 0.30 (1.260 0.012)
2.18 (0.086) 2.41 (0.095) 2.21 (0.087) 2.66 (0.105)
1.19 R (0.046)
1.25 (0.049) 2.75 (0.108)
0.419 0.013 (0.0165 0.0005)
3.86 (0.152)
13.39 (0.527)
7.46 (0.294)
15 MAX.
9.27 11.66 0.10 (0.365) (0.459 0.004)
5 MAX.
1.5 MAX. 15.38 0.10 (0.606 0.004) 16.99 0.10 (0.669 0.004)
AO
DIMENSIONS ARE IN MILLIMETERS (INCHES).
KO
BO
5
Tape and Reel Dimensions
Option #0x8
16.00 0.10 (0.630 0.004)
1.55 0.10 (0.061 0.002) 4.00 0.10 (0.157 0.004) 2.00 0.10 (0.079 0.004) 1.75 0.10 (0.069 0.004)
14.20 0.10 (0.559 0.004)
32.00 0.30 (1.26 0.012)
1.14 R (0.045) 2.74 (0.108) 6.53 (0.257) 5.03 (0.198) 0.368 0.013 (0.0145 0.0005)
2.00 + 0.25 (0.079 + 0.010)
1.70 (0.067) 3.58 (0.141)
7 MAX.
4 MAX.
9.02 0.10 (0.355 0.004)
7.04 0.10 (0.277 0.004)
17.15 0.10 (0.675 0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
6
Tape and Reel Dimensions
Option #S07
24.00 0.10 4.00 0.10 2.00 0.10 1.50 0.10 1.75 0.10
14.20 0.10
32.00 0.30
0.76 x 45 2.18 2.41 3.18 2.67 -0.419 0.013
1.19 R
13.50 2.75 1.25 4.80
8.23 15 MAX. 12.34 0.10
9.80 5 MAX.
1.5 MAX. 16.97 0.10
15.56 0.10
AO
DIMENSIONS ARE IN MILLIMETERS.
KO
BO
Table 1. Recommended Application Circuit Components
Component R1 R2 R3 CX1 CX2 CX3 CX4 CX5 CX6 CX7 560 , 5%, 0.125 Watt 4.7 , 5%, 0.5 Watt 10 , 5%, 0.125 Watt 0.47 F, 10%, X7R Ceramic 220 pF, 10%, X7R Ceramic 4700 pF, 10%, X7R Ceramic 0.010 F, 10%, X7R Ceramic 0.47 F, 20%, X7R Ceramic 5 mm lead length 6.8 F Tantalum. Larger value recommended for noisy supplies or environments 0.47 F, 20%, X7R Ceramic 3 2 1 2 Recommended Value Notes
Notes: 1. In environments with noisy power supplies, supply rejection can be enhanced by including R3 as shown in application circuit on page 1. 2. CX1 and CX5 must be placed within 0.7 cm of the HSDL-1100 to obtain optimum noise immunity. 3. Only necessary in applications where transmitter switching causes more than a 50 mV ripple on VCC.
7
Truth Table
Inputs TXD VIH VIL VIH VIL
X = Don't care NV = Not Valid Notes: 4. In-Band EI 115.2 Kb/s. 5. In-Band EI 576 Kb/s. 6. Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident intensity.
EI X EIH[4] EIH[5] EIL
IE (LED) High Low Low Low
Outputs RXD-A NV Low[6] NV High
RXD-B NV NV Low[6] High
Pinout
Pin 1 2 3 4 5 6 7 8 9 10 Description PIN Bypass Capacitor Ground (Analog) Averaging Capacitor Supply Voltage Receiver Data Output - Channel B Ground Transmitter Data Input Receiver Data Output - Channel A Threshold Capacitor LED Anode Symbol
PIN 1 PIN 10
CX1 GND CX4 VCC RXD-B GND TX RXD-A CX3 LEDA
PIN 10 HP 1100 YYWW PIN 1
NOTE: PINS 1 AND 10 ARE COMPRISED OF TWO PHYSICAL LEADS EACH. THE TWO PHYSICAL LEADS OF EACH PAIR SHOULD BE TIED TOGETHER ELECTRICALLY ON THE APPLICATION PC BOARD.
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance 50C/W. Parameter Symbol Min. Max. Units Storage Temperature Operating Temperature Average LED Current Average LED Current Repetitive Pulsed LED Current Peak LED Current LED Anode Voltage Supply Voltage Transmitter Data Input Current Receiver Data Output Voltage TS TA ILED (DC1) ILED (DC2) ILED (RP) ILED (PK) VLEDA VCC ITXD (DC) VRXD-A VRXD-B -0.5 0 -12 -0.5 -0.5 -20 0 85 70 100 165 660 1.0 7.0 7.0 12 VCC + 0.5 VCC + 0.5 C C mA mA mA A V V mA V V 90 s Pulse Width, 25% Duty Cycle 90 s Pulse Width, 25% Duty Cycle 2 s Pulse Width, 10% Duty Cycle Conditions
8
Infrared Reflow Profile
300 t2 = 11.5 .5 MINS. (SOLDER JOINT) 250
TEMPERATURE - C (T)
T (MAX.) = 250 C OR 235 C (+5-0) C ANY PART OF COMPONENT BODY t1 = 8 1 MINS. (SOLDER JOINT) 185 C 3.5 .5 MINS. (SOLDER JOINT) T > 120 C FOR t GREATER THAN 2.5 MINS. (SOLDER JOINT) dT/dt < 3 C/SEC.
200 150 100 50 0
0
2
4
6 TIME (t)
8
10
12
14
Recommended Operating Conditions
Parameter Operating Temperature Supply Voltage Logic High Transmitter Input Voltage (TXD) Logic Low Transmitter Input Voltage (TXD) Logic High Receiver Input Irradiance Logic Low Receiver Input Irradiance LED (Logic High) Current Pulse Amplitude Receiver Setup Time Receiver Signal Rate RXD-A Receiver Signal Rate RXD-B Ambient Light Symbol TA VCC VIH VIL EIIH EIIL ILEDA 400 Min. 0 4.75 4.25 0.0 0.0036 0.0090 Max. 70 5.25 5.25 0.3 500 500 0.3 660 1.0 2.4 0.576 116 4 Units C V V V mW/cm2 For in-band signals 116 Kb/s mW/cm2 For in-band signals 576 Kb/s W/cm2 For in-band signals mA ms Kb/s Mb/s See IrDA Serial Infrared Physical Layer Link Specification, Appendix A for ambient levels. For full sensitivity after transmitting Conditions Case to Ambient Thermal Resistance 50C/W Notes 9 8 8 7 7 9
Notes: 7. An in-band optical signal is a pulse/sequence where the peak wavelength, p, is defined as 850 nm p 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 8. With RI, CX2 Input network and where tr (VI ) and tf (VI ) 5 ns. See Application Circuit (Table 1) for component values. The driver gate for this input should be able to source and sink 6 mA (DC) and 50 mA (pk). TXD refers to the node on the driver gate side of R1, CX2 on application circuit. 9. See the thermal derating curves on pages 8 and 9 for maximum operating conditions in order to maintain T junction <125C.
All HSDL-1100 IR transceivers are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed draft scheduled to go into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. See Hewlett-Packard Application Note 1094 for more information.
9
Electrical and Optical Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worse case values for the parameters under test. Unspecified test conditions can be anywhere in their operating range. All typicals are at 25C and 5 V unless otherwise noted.
Parameter Receiver Data Output Logic Low Symbol VOL (RXD-A) VOL (RXD-B) VOH (RXD-A) VOH (RXD-B) 21/2 EI VCC-0.6 VCC-1.2 30 0.2 100 177 Min. Typ. Max. 0.5 Unit V Conditions IO (RXD-A) = 1.0 mA, For in-band EI 3.6 W/cm2, 1/2 15 IO (RXD-B) = 1.0 mA, For in-band EI 9.0 W/cm2, 1/2 15 IOH (RXD-A) = -20 A, For in-band EI 0.3 W/cm2 IOH (RXD-B) = -20 A, For in-band EI 0.3 W/cm2 Notes 11
Voltage
Logic Low 0.5 V
11
Logic High Logic High Viewing Angle Effective Detector Area Transmitter Radiant Intensity Logic High
V V degrees cm2
mW/SR VIH (TXD) = 4.25 V ILEDA = 400 mA TA = 25C, 1/2 15 324 mW/SR VIH (TXD) = 4.25 V ILEDA = 400 mA 0C TA 70C, 1/2 15 nm nm 60 2.0 6.6 2.78 250 degrees A mA V A mA mA GND VIL (TXD) 0.3 V VIH (TXD) = 4.25 V ILEDA = 400 mA, 25C VIH (TXD) = 4.25 V VLEDA = VCC = 5.25 V, VIL (TXD) = 0.3 V VCC = 5.25 V, VI (TXD) = VIL, EI = 0 VCC = 5.25 V, VI (TXD) = VIL, EI 500 mW/cm 2
10
EI
80
177
10
Peak Wavelength Spectral Line Half Width Viewing Angle Transmitter Logic Low Logic High On State Voltage Off State Leakage Supply Current Idle Active Receiver Receiver Peak Sensitivity Wavelength
p 1/2 21/2 I IL(TXD) IIH(TXD) VON (LEDA) I LK (LEDA) ICC1 ICC2 30 -2.0 5.4
875 35
10 10 10 10
Data Input Current
LED Anode
3 4
5.1 18
p
880
nm
Notes: 10. With R1, CX2 input network. See Application Circuit (Table 1) for component values. TXD refers to driver gate of R1, CX2 on application circuit. 11. Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident intensity.
10
Switching Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worst case values for the parameters under test. Unspecified test conditions can be anywhere in their operating range. All typicals are at 25C and 5 V unless otherwise noted. Parameter Transmitter Radiant Intensity Pulse Width Symbol tpw (IE) Min. 1.5 115 Transmitter Radiant Intensity Rise and Fall Times RXD-A Pulse Width RXD-B Pulse Width RXD-B Pulse Width (ASK) Receiver Latency Time tL (RXD-B) tL (RXD-A) tr(IE), tf(IE) tpw (RXD-A) tpw (RXD-B) Typ. 1.6 125 Max. 1.8 135 40 1.0 75 0.7 1.0 0.50 7.5 185 1.3 1.0 Unit s ns ns s ns s ms Conditions tpw (TXD) = 1.6 s at 115.2 K pulses/second tpw (TXD) = 125 ns at 2.0 M pulses/second tpw (TXD) = 125 ns at 2.0 M pulses/second 1/2 15 1/2 15 500 kHz/50% duty cycle carrier ASK Notes 12 12
13 14 15 13, 14
Notes: 12. Pulse widths measured at 1.4 volts. 13. For In-Band signals 115.2 Kb/s where 3.6 W/cm2 EIL 500 mW/cm2 . 14. For In-Band signals, 125 ns PW, 4 Mb/s, 4 PPM where 9.0 W/cm2 EI 500 mW/cm2. 15. Pulse width specified is the pulse width of the second 500 kHz carrier pulse received in a data bit. The first 500 kHz carrier pulse may exceed 2 s in width, which will not affect correct demodulation of the data stream. An ASK and DASK system using the HSDL-1100 has been shown to correctly receive all data bits for 9 W/cm2 Thermal Derating Curves
These 2 graphs show maximum allowable LED drive current as a function of ambient temperature and the designer's PCB-to-ambient thermal resistance.
MAXIMUM AMBIENT TEMPERATURE (C)
100 80 60 40 20 0 REFERENCE -20 0 0.2 0.4 0.6 0.8 REFERENCE THERMAL RESISTANCE BOARD TO AMBIENT 50 C/W 100 C/W GUARANTEED 150 C/W 200 C/W 250 C/W 300 C/W
MAXIMUM AMBIENT TEMPERATURE (C)
100 80 60 40 20 0 REFERENCE -20 0 0.2 0.4 0.6 0.8 REFERENCE THERMAL RESISTANCE BOARD TO AMBIENT 50 C/W 100 C/W GUARANTEED 150 C/W 200 C/W 250 C/W 300 C/W
LED DRIVE CURRENT (A)
LED DRIVE CURRENT (A)
HSDL-1100#0x7 Leadform Max. Ambient vs. LED Drive Current
HSDL-1100#0x8 Leadform Max. Ambient vs. LED Drive Current
*Note: Performance is guaranteed in the operating temperature range of 0C - 70C. The information provided outside of this range is for reference only.
11
0.8
MAXIMUM DRIVE CURRENT (A)
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 100 120
JUNCTION TO CASE MEASUREMENTS FOR HSDL-1100#0X7 MAX. CASE TEMPERATURE If (mA) (C) 400 101.3 450 98.4 500 95.3 550 92.1 600 88.7 650 85.2 700 81.6 750 77.9
CASE TEMPERATURE (C)
HSDL-1100#0x7 Leadform Max. LED Drive Current vs. Case Temperature
Appendix A. Test Methods
A.1. Background Light and Electromagnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 3 V/m maximum (refer to IEC 801-3. severity level 3 for details) 2. Sunlight: 10 kilolux maximum at the optical port This is simulated with an IR source having a peak wavelength within the range 850 nm to 900 nm and a spectral width less than 50 nm biased to provide 490 W/cm2 (with no modulation) at the optical port. The light source faces the optical port.
This simulates sunlight within the IrDA spectral range. The effect of longer wavelength radiation is covered by the incandescent condition. 3. Incandescent Lighting: 1000 lux maximum This is produced with general service, tungsten-filament, gasfilled, inside-frosted lamps in the 60 Watt to 150 Watt range to generate 1000 lux over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The source is expected to have a filament temperature in the 2700 to 3050 degrees Kelvin range and a spectral peak in the 850 nm to 1050 nm range.
4. Fluorescent Lighting: 1000 lux maximum This is simulated with an IR source having a peak wavelength within the range 850 nm to 900 nm and a spectral width of less than 50 nm biased and modulated to provide an optical square wave signal (0 W/cm2 minimum and 0.3 W/cm2 peak amplitude with 10% to 90% rise and fall times less than or equal to 100 ns) over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The frequency of the optical signal is swept over the frequency range from 20 kHz to 200 kHz. Due to the variety of fluorescent lamps and the range of IR emissions, this condition is not expected to cover all circumstances. It will provide a common floor for IrDA operation.
www.hp.com/go/ir For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright (c) 1998 Hewlett-Packard Co. Obsoletes 5967-6063E 5968-1408E (7/98)


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